Vapor Chamber Type 히트 파이프를 이용한 고출력 백색 LED 조명등의 방열에 관한 연구

Abstract

High power light emitting diode(LEDs), a strong candidate for the next generation illumination applications are of interest. With major adanvtage of power saving, increased life expectancy and faster response time over traditional incandescent bulb, the high power LEDs are rapidly taking over many applications such as LCD backlighting, traffic lights, automotive lighting, signage, etc. The increased electrical currents used to drive the LEDs have focused more attention on the thermal management because the efficiency and reliability of the solid-state lighting devices strongly depend on successful thermal management. There exist some problems that are caused by heat generation in the LED package, such as wire breakage, yellowing of epoxy resin, lifted chip caused by reflow of thermal paste chip attach and interfacial separation between LED package and silicon resin. The goal of this study is to analyze thermal properties of a LED package and to propose an high power 16W white LED lamp using vapor chamber type heat pipe. The heat pipe was used as a heat spreader. When a vapor chamber type heat pipe is supplied 16W, optimum working fluids was R-134a, its charging ratio is 10%, 20%, 30%, 40%, 50% to volume. From the experimental result, the thermal resistance of high power 16W white LED lamp was about 5.456℃/W. And the thermal resistance of high power 16W LED white lamp using vapor chamber type heat pipe was about 2.166℃/W, 2.501℃/W, 2.227℃/W, 2.138℃/W, 1.916℃/W respectively 10%, 20%, 30%, 40%, 50% to volume. This study showed that vapor chamber type heat pipe can be a good tool improve cooling performance of high power LED lamp.