파우더 형상에 따른 패드 인쇄용 실버 페이스트의 물성 연구
- Alternative Title
- Study properties of pad printing silver paste according to the powder form
- Abstract
- Study properties of pad printing silver paste according to the powder form
Yeong-Hwan Kim
Dept. of Graphic Arts Engineering, Graduate School,
Pukyong National University
Abstract
Mobile phones, Digital cameras, DVD (Digital video disk), PDP (Plasma display panel), LCD (Liquid crystal display), DMB (Digital multimedia broadcasting) and other digital consumer electronics market grows significantly, semiconductors and other electronic parts and equipment needs for the manufacturing process has also changed significantly. IC (Integrated circuit), electronic components, LCD, PDP, OLED (Organic light emitting diode) and the display market, in addition to donor-acceptor type of organic solar cells, titanium dioxide, zinc oxide, etc., such as dye-sensitized solar cells and fuel cells, even in the energy sector of the new As the commercialization of the production process closer to the simplification and process are being explored to reduce cost.
Production of printed electronics technology can be applied to the case of cleaner production, and increase productivity by reducing process waste from the exposure process and the material cost reductions through cost savings can be used to improve the competitiveness of the product. The process can enable low-temperature plastic substrate, and through it, and so can easily form a large-area thin-film process is made possible. Current specific application (RFID(Radio frequency identification) , Display for the Color filter, etc.) are being commercialized in a variety of print methods to achieve this is through. A method of forming a conductive pattern on an existing, but mainly using a screen printing method, the screen printing is usually flat or round surface that is printable only marginal. Unlike these screen-printing, after dug thin pad printing flat iron plate, after etching by the ink was applied, it issues taken with silicone pad is free on the product shape in the printing method of printing the remanufactured . Compared to the screen there products are an advantage capable also an oval shape with high precision, but thinner the thickness of the print, the initial cost and the time-consuming bit more. In this study, a screen printing process in order to complement the limitations in the printing process as described above, after the comparative analysis of the pad printing process which has been studied and a superior electrical conductivity along the powder form by considering the physical properties to ensure adhesion and excellent pattern was the goal of research.
In this study, a screen printing process in order to complement the limitations in the printing process as described above, after the comparative analysis of the pad printing process which has been studied and a superior electrical conductivity along the powder form by considering the physical properties to ensure adhesion and excellent pattern was the goal of research.
- Author(s)
- 김영환
- Issued Date
- 2016
- Awarded Date
- 2016. 2
- Type
- Dissertation
- Keyword
- 패드인쇄 패드 PAD 전도성 페이스트
- Publisher
- 부경대학교 대학원
- URI
- https://repository.pknu.ac.kr:8443/handle/2021.oak/13157
http://pknu.dcollection.net/jsp/common/DcLoOrgPer.jsp?sItemId=000002233395
- Alternative Author(s)
- Yeong-Hwan Kim
- Affiliation
- 부경대학교 대학원
- Department
- 대학원 인쇄공학과
- Advisor
- 남수용
- Table Of Contents
- Ⅰ. 서 론 1
Ⅱ. 이 론 3
1. 패드 인쇄법 3
가. 패드 인쇄 3
나. 패드 인쇄 잉크의 전이 3
다. 실리콘 패드 6
2. 금속 페이스트 7
가. 전도성 필러 7
나. 바인더 9
다. Percolation point와 Percolation curve 9
3. 분산 메커니즘 10
가. 분산 기초 이론 11
나. 분산 공정 및 분산성 평가 14
다. 삼본밀에 의한 분산 메커니즘 16
4. 레올로지 18
가. 틱소트로피 20
나. 동적 점탄성 21
Ⅲ. 실 험 24
1. 시료 24
가. 전도성 필러 24
나. 바인더 26
다. 용제 27
2. 실험방법 27
가. Ag paste의 구성 28
나. Ag paste 제조방법 28
다. 패드 인쇄 29
3. 측정 및 분석 31
가. Ag paste의 분산 특성 측정 31
나. Ag paste의 레올로지 특성 측정 32
다. 전도성패턴의 접착성 측정 32
라. 전도성패턴의 전기전도성 측정 33
Ⅳ. 결과 및 고찰 34
1. Ag paste의 분산성 34
2. Ag paste의 레올로지 특성 35
3. Ag paste의 패드 인쇄 조건 38
4. Ag paste의 패드 인쇄 적성 40
5. 전도성 패턴의 접착성 측정 42
7. Ag 입자 형태 및 수지 분자량에 따른 paste의 전기전도성 43
Ⅴ. 결 론 45
참고문헌 47
- Degree
- Master
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- 대학원 > 인쇄공학과
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