CAE를 이용한 소형박육제품의 변형 패턴에 관한 연구

Abstract

An FPC(Flexible Printed Circuit) connector is a part that connects a flexible circuit board and transmits a signal. A housing product made by injection mold is main part of FPC connector and it’s warpage is generated by the difference of shrinkage ratio at each part of the molded product. This warpage causes poor contact of assembling the FPC connector and the flexible circuit board and poor soldering of SMT(Surface Mounter Technology) in PCB(Printed Circuit Board) board. Modification of a mold needs a lot of cost and time to reduce warpage. Therefore, it is necessary to make effort to optimize the product design and mold design by predicting the problems expected in the injection molding process through the molding analysis. In this study, analysis results of warpage according to shape of FPC were confirmed and difference of results between CAE and actual products was compared. As a result, the minimum warpage of 0.041mm was occurred in the analysis and the mold sample had 0.036 ~ 0.048mm. So, it indicates that warpage results of analysis and products are similar. Thus, the warpage can be effectively reduced through the analysis of injection molding process in advance.