강판 결함 검출용 시스템-온-칩 설계
- Alternative Title
- System-on-Chip Design for Detecting Steel Plates Defects
- Abstract
- Abstract
In this thesis, we research on the design and fabrication of the SoC(System-on-Chip) for detecting steel plates defects. Core circuits in such a System-on-Chip are composed of PGA(Programmable Gain Amplifier) and SAR-ADC(Successive Approximation Register-Analog to Digital Converter).
In general, systems for detecting steel plates defects are fabricated by PCB, but it has several problems in terms of production cost, power consumption and area which occupy in a system. However, in case of being implemented by not PCB but SoC, it has the advantages of low cost, low power consumption and small area. Therefore, to solve problems of system fabricated by PCB, we implement core circuits in a system for detecting steel plates defects into SoC.
In this thesis, the PGA, the first core circuit in a SoC for detecting steel plates defects, was designed by using a fully differential amplifier to minimize external noise, and by using degeneration resistance and CMOS switch-on-resistance to implement low power and small area. The PGA was also implemented by using layout optimization techniques of common matching and latch to minimize area which occupies in a SoC. As a result, we identified that the PGA for a SoC has seven gain control functions and very low gain error of less than 0.18dB. It also showed very low power consumption of 0.47mW in a supply voltage of 1.8V and small area of .
The SAR-ADC, the second core circuit in the proposed SoC, consisted of sample-and-hold stage, capacitor array network stage, SAR control logic stage, comparator stage, DAC stage and DAC control logic stage. This SAR-ADC was designed and implemented to minimize area and power consumption in a SoC, and to have performance of 12-bit resolution and 1MSps(Mega Sampling per second). As a result, the SAR-ADC showed excellent SNDR(Signal to Noise Distortion Ratio) of 69.53dB and ENOB(Effective Number of Bit) of 11.26-bit. It also showed low power consumption of 3.6mW in a supply voltage of 1.8V and small area of
The proposed SoC in this thesis was designed and fabricated by using 0.18 1Poly 6Metal CMOS process from Magnachip semiconductor, Co., Ltd. The proposed SoC showed very low power consumption of 4.07mW and very small area of .
- Author(s)
- 김성우
- Issued Date
- 2014
- Awarded Date
- 2014. 2
- Type
- Dissertation
- Publisher
- 부경대학교
- URI
- https://repository.pknu.ac.kr:8443/handle/2021.oak/1441
http://pknu.dcollection.net/jsp/common/DcLoOrgPer.jsp?sItemId=000001966850
- Alternative Author(s)
- Kim, Sung Woo
- Affiliation
- 대학원
- Department
- 대학원 정보통신공학과
- Advisor
- 류지열
- Table Of Contents
- Abstract
제1장 서 론 ··················································· 1
제2장 강판 결함 검출 시스템과 구현 대상 시스템-온-칩 ······································· 4
2.1 강판 결함 검출 시스템 ····························· 4
2.2 구현 대상 시스템-온-칩 ···························· 7
제3장 이득 증폭부 설계 및 레이아웃 ················ 12
3.1 이득 증폭의 기본 기능 및 특징 ················· 12
3.2 시스템-온-칩용 PGA부 설계 및 레이아웃 ····· 14
3.2.1 시스템-온-칩용 PGA부 설계 ························ 14
3.2.2 시스템-온-칩용 PGA부 레이아웃 및 검증 ·········· 22
3.2.2.1 레이아웃 설계 규칙 및 검증 방법 ······················ 22
3.2.2.2 레이아웃시 적은 면적 점유를 위한 설계 ·············· 29
3.2.2.3 구현 레이아웃 대상 DRC 및 LVS 검증 ··············· 36
3.3 시스템-온-칩용 PGA부 설계 및 구현 평가 ····· 41
제4장 시스템-온-칩용 SAR-ADC부 설계 및 구현 ················································ 45
4.1 일반적인 ADC와 SAR-ADC의 기본 구조 및 동작 원리
··········································· 45
4.2 ADC 성능 지수 및 주요 서식 ·················· 54
4.3 시스템-온-칩용 SAR ADC 설계 및 구현 ····· 58
4.3.1 샘플-앤-홀드단 설계 및 레이아웃 ················· 60
4.3.2 커패시터 어레이 네트워크 설계 및 레이아웃 ··· 67
4.3.3 비교기단 설계 및 레이아웃 ························ 78
4.3.4 SAR 제어 로직단 설계 및 레이아웃 ·············· 88
4.3.5 DAC 제어 로직단 설계 및 레이아웃 ············· 120
4.3.6 DAC단 설계 및 레이아웃 ·························· 127
4.4 시스템-온-칩용 SAR ADC부 구현 평가 및 성능 평가
··········································· 135
4.4.1 시스템-온-칩용 SAR-ADC부 구현 평가 ··········· 135
4.4.2 시스템-온-칩용 SAR-ADC부 성능 평가 ··········· 139
제5장 강판 결함 검출용 시스템-온-칩 성능 분석 및 측정
·············································· 142
5.1 시스템-온-칩 성능 분석 ·························· 142
5.2 시스템-온-칩 측정 ································· 147
제6장 결론 ·················································· 151
참고문헌 ·························································· 153
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