Multiphysics Thermal Design of Packaged Power Terminals and Heater Plates for Wafer Thermal Prcessing
- Alternative Title
- 웨이퍼 열 공정에 사용되는 패키징된 파워 단자부 및 히터 플레이트의 다중물리적 열 설계
- Abstract
- Heater plates (HPs) are main modules in the wafer thermal processing. The robustness of the HPs is critical to improve the reliability of the wafer thermal processing. However, failures of the packaged power terminals (PPTs) and the HPs frequently occur due to harsh thermal processing conditions. Therefore, thermal performances of the PPTs and the HPs should be carefully explored.
The finite element analysis (FEA) electrical-thermal model and the FEA thermal model were developed for the PPTs and the HPs, respectively, and verified by measurements. Various parametric influences on the thermal performance of the PPT were investigated by the FEA electrical-thermal models. In addition, the FEA thermal models explored influences of the heating element width, the gap between adjacent heating elements, and the heating zone gap on the thermal performances of the HPs including their effects on the axial temperature profiles of the upper surfaces of the HPs.
The study for PPTs has found a 10K higher temperature of the heating element compared with the substrate for the reference conditions of the PPTs. The parametric studies of the PPT show that the substrate thickness is a dominant parameter affecting the thermal performance of the PPT. It is seen that the axial temperature difference of the heating element decreases by 61% with the increase of the substrate thickness from 0.5mm to 5mm. The results show that associated with the increase of the heating element area, the solder contact area, and the solder thickness, the value of the maximum temperature of the heating element is slightly reduced by nearly 1%. However, it is seen that the value of the axial temperature difference of heating element is substantially reduced by about 10%. The parametric study for the HPs has found that the effect of the heating element width on the heater performance is negligible. The optimum design of the heating zone and the heating element gap could considerably alleviate the axial temperature difference of the upper surface of the HP by 56% compared with the baseline condition.
- Issued Date
- 2018
- Awarded Date
- 2018. 8
- Type
- Dissertation
- Publisher
- 부경대학교
- Alternative Author(s)
- 우대성
- Affiliation
- 부경대학교 대학원
- Department
- 대학원 기계설계공학과
- Advisor
- 김경준
- Table Of Contents
- Acknowledgment i
Contents ii
List of Figures v
List of Tables vii
Nomenclature viii
Abstract ix
I. Introduction 1
1.1 Background and purpose 1
1.2 Objective and research method 2
1.3 Thesis outline 3
II. FEA Modelling 4
2.1 Packaged power terminals 4
2.1.1 Problem statment 5
2.1.2 Governing equation 6
2.1.3 Summary of auumptions and material properties 6
2.1.4 FEA electrial-thermal model and boundary conditions 8
2.2 Heater plates 10
2.2.1 Problem statement 11
2.2.2 Governing equation 11
2.2.3 Summary of assumptions and material properties 12
2.2.4 FEA thermal model and boundary conditions 14
III. Experimental Methodology 17
3.1 Experiment of PPT 17
3.1.1 Test rig design 17
3.1.2 Measurement equipment 19
3.1.3 Test procedure 21
3.1.4 Verification results 24
3.2 Experiment of HP 25
3.2.1 Test rig design 25
3.2.2 Measurement equipment 26
3.2.3 Test procedure 26
3.2.4 Verification results 27
IV. Results and Discussions 28
4.1 Simulation results of PPT 28
4.1.1 Voltage and current density fields 29
4.1.2 Temperature fields 30
4.1.3 Boundary conditions effects 31
4.1.4 Substrate thickness effects 33
4.1.5 Encapsulant thermal conductivity effects 34
4.1.6 Heating element area effects 35
4.1.7 Solder contact area effects 37
4.1.8 Solder thickness effects 38
4.2 Simualtion results of HP 40
4.2.1 Temperature fields 40
4.2.2 Heating element width effects 42
4.2.3 Zone and heating element gap effects 44
V. Conclusions 46
List of Publications 48
References 50
- Degree
- Master
- Files in This Item:
-
-
Download
Multiphysics Thermal Design of Packaged Power Terminals and Heater Plates for Wafer Thermal Prcessin.pdf
기타 데이터 / 2.11 MB / Adobe PDF
-
Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.