반도체 소자에 적용 가능한 은나노와이어 잉크의 전자파 차폐에 관한 연구

Abstract

Recently the geometric shrink and high performance of electronic devices has become a problem in product design with the electromagnetic interference between the parts within the product. It has been commonly used to reduce electromagnetic interference between the components using a metallic plate called a shield can, or a plastic case with a conductive paint. However, product weight has been lighter and lighter and the component density in the device has been increased, Also the clock speed of chip has been increased. Such as the shielding method of the traditional electromagnetic wave may not appropriate for the protection of electromagnetic interference between parts. It causes to use as the other means of electromagnetic shielding technology to replace the traditional method with the plating, vapor deposition, and use of conductive ink. The vapor deposition technology is the most popular technology. However, the vapor deposition is the high-cost technology that require the nice and expensive equipment to be applied and not good solution to use for a small quantity of products. In this study, the technology to replace the electromagnetic shielding using the vapor deposition, the possibility of electromagnetic shielding technology using silver nano wire ink was considered to be examined for the shielding efficiency of the electromagnetic interference. Using the silver nano wire ink, the sample produced by considering the characteristics of the semiconductor as thin as possible, and sufficient shielding effect can be applied to have adequate volume resistance. The shielding effect was measured by ASTM D4935-99 test method with the samples. These measured results showed better performance than theoretical estimates, and by default they were identified to meet the performance requirements of more than 30dB of electromagnetic shielding. Therefore, the shielding technology using the silver nano wire ink could be effective enough as electromagnetic shielding method in this study.