액체금속을 이용한 실리콘 태양전지 모듈의 상온인터커넥션 방법에 대한 연구

Abstract

In order to connect solar cells in series in the production of a crystalline silicon solar cell module, a tabbing and string process is performed to interconnect the metal ribbon with the bus electrode of the solar cell. During the high temperature soldering, the difference in thermal expansion coefficient between the metal and the silicon causes the solar cell bowing problem or breakage. In particular, since the cost structure of solar cell modules is large in proportion to the cost of silicon, the thickness of solar cell wafers is gradually decreasing in order to reduce costs. As the thickness of the solar cell wafer becomes thinner, the damage of the solar cell is expected to increase. In this study, we present a new interconnection method for thin solar cells. It can be done at a room temperature and hence no mechanical stress is developed between the metal ribbons and the solar cell. Also, the efficiencies between the conventional soldering method and the room temperature interconnection method has no big differences. Thus, the room-temperature interconnection method can be an alternative to conventional soldering methods for thin solar cell wafers.