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소결금속 비등 전열면을 이용한 베이퍼챔버형 히트파이프의 LED 조명등 방열 성능에 관한 연구

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Abstract
To solve the problem with fluorescent lamps and incandescent lamps which has been the conventional illumination system will greatly enhanced energy efficiency and lifetime of the LED(Light Emitting Diode) lighting device. Recently, LED lighting system has attracted the attention of the industries and its lighting technology is different from incandescent lamp because it has no filaments which make it more robust and strong to resist vibrations effect. LED lighting system shows less energy consumption, electric spark does not occur and this will greatly improves the performance and stability of indoor lighting system. However, 80% of the electrical energy used in LED is converted into heat through effective heat dissipation of LED temperature modules and lowering the substrate temperature to improve the reliability, lifetime and heat problem should be minimized. Optimal heat dissipation design and equipment manufacturing LED lifetime and the performance can be improved.
Relying on natural convection heat dissipation of the LED is fast becoming a better lighting practice but LED heat generation and dissipation remain a great concern. In order to solve these problems, we use VCTHP(Vapor Chamber Type Heat Pipe). Which has a heat spread role and heat transfer rate 2000 times higher than copper within a short time and large amount of heat can be transported. Optimal quantity state of horizontal fin vapor chamber is R-141b 35%, and the heat transfer surfaces are sintered. At this time, the LED chip temperature was 91.0℃, the thermal resistance 10.84 ℃/W. In transformed vertical fin VCTHP was best thermal performance at R-141b 45%. In this regard, the lowest temperature of LED chip was 77.3℃ and thermal resistance was 8.32 ℃/W. Performance of VCTHP for heat dissipation in LED illumination cooling system was excellent in all conditions in this study.
Author(s)
허준
Issued Date
2014
Awarded Date
2014. 2
Type
Dissertation
Publisher
부경대학교
URI
https://repository.pknu.ac.kr:8443/handle/2021.oak/1538
http://pknu.dcollection.net/jsp/common/DcLoOrgPer.jsp?sItemId=000001966947
Affiliation
대학원
Department
대학원 냉동공조공학과
Advisor
김종수
Table Of Contents
ABSTRACT ⅲ
Nomenclature ⅴ

제 1 장 서론 1
1.1 연구의 배경 1
1.2 LED의 개념과 특징 3
1.3 LED 방열의 필요성 6
1.4 LED 방열의 선행 기술 12
1.4.1 COB 기술 13
1.4.2 COH 기술 14
1.4.3 Hearsink PCB 기술 15

제 2 장 히트파이프를 이용한 LED chip 방열 관련이론 16
2.1 Vapor Chamber Type 히트파이프 16
2.1.1 Vapor Chamber Type 히트파이프의 구조 및 원리 13
2.1.2 작동 유체의 선정 20
2.1.3 안정작동을 위한 관경 상관식 27
2.2 소결 30
2.3 LED에서의 열 저항 36
2.3.1 열접촉저항 39


제 3 장 실험장치 및 방법 41
3.1 6.5 W 주백색 LED 조명등의 실험 장치 41
3.2 6.5 W 주백색 LED 조명등의 실험 방법 44
3.3 수평핀 Vapor chamber type LED 조명등의 실험 장치 45
3.4 수평핀 Vapor chamber type LED 조명등의 실험 방법 50
3.5 수직핀 Vapor chamber type LED 조명등의 실험 장치 53
3.6 수직핀 Vapor chamber type LED 조명등의 실험 방법 57
3.7 Vapor chamber type heat pipe의 열적 모델링 60

제 4 장 실험결과 63
4.1 6.5W 주백색 LED 조명등의 온도분포 63
4.2 수평핀 Vapor chamber type LED 조명등의 온도분포 65
4.3 수직핀 Vapor chamber type LED 조명등의 온도분포 69
4.4 6.5 W 주백색 LED 조명등의 실험 장치별 LED chip 온도 및
열 저항 비교 72

제 5 장 결 론 75

참고 문헌 77

謝 辭 80
Degree
Master
Appears in Collections:
대학원 > 냉동공조공학과
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