무전해 Ni-Cu-P 폐 도금액의 재사용에 관한 연구(Ⅱ)
- Alternative Title
- A Study on Reusing of Electroless Ni-Cu-P Waste Solution(Ⅱ)
- Abstract
- Reusing of electroless Ni-Cu-P waste solution was investigated in the plating time, plating rate and deposit.
It is difficult for initial solution with 55% waste solution additive at batch type to reuse the waste solution. Initial solution with 60% waste solution additive at continuous type is a task of great difficulty to reuse of waste solution. Component change of nickel-copper for electroless deposition was increased by deposited inferiority and with decrease of plating time.
- Issued Date
- 2002
- Type
- Article
- Publisher
- 釜慶大學校
- Alternative Author(s)
- Oh, Lee-Sik Bai, Yong-Han
- Affiliation
- 부경대학교 공과대학 재료공학부
부경대학교 대학원 금속공학부
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