Ni 분말이 함침된 TPU 및 열 경화형 에폭시 접착제의 유도가열 발열 거동 및 접착 특성에 관한 연구

Abstract

Nowadays, in order to improve an efficiency of manufacturing process according to developing of technologies and industry, diverse studies have been vigorously conducting. Among a lot of industries, bonding process included in shoes, automobile or aircraft area is generally using convection oven method for heating the material. This method can be applied to consecutive processing for a large quantity of material as well as huge object such as automobile. However, because heat moves from surrounding air to adhesive through the object, object can be damaged thermally. Therefore, for replacing this heating method, a new method is needed for speedy and efficiency heating. Induction heating is a method which heats the object using by high frequency alternating magnetic field (AMF). Because it is adopting the amf, it can be possible non-contact, selective and localized heating. Hence, induction heating was utilized in welding, annealing or melting of metal in the past, now it is being used for hyperthermia, electric stove as well as bonding between metal and polymer. When the induction heating is applied to shoe, automobile and aircraft industries, more efficient heating process can be possible by reducing the processing time. In order to apply an induction heating method to manufacturing process, object should has a conductive or magnetic property. However, normal adhesive do not have these properties, so magnetic materials such as metal or ceramic should be embedded into the adhesive for generating heat. There are lots of studies about induction heating behavior of metal particles such as Fe, Ni, Co, Cu, Fe3O4. As a result, It was possible that controling the heat generation by regulating size, contents of particle, output of induction heater and adhesive thickness. Also, this heating method showed a faster heating speed and higer efficiency than oven heating. In this paper, spherical type Ni particle with 70㎚, 1㎛, 70㎛ in size, flake and irregular type Ni particle with 1㎛ in size were used as a susceptor for observing an induction heating behavior and adhesion properties of TPU (Thermoplastic poly urethane) adhesive with respect to size, contents and shape of Ni. Furthermore, induction heating behavior and adhesion property of multi layered TPU adhesive with core layer in regard to content of Ni particle have been studied. Additionally, induction heating behavior and adhesion property of one component epoxy adhesive with 70㎚ Ni spherical type particle also have been studied on thickness of adherend, content of Ni.