NFC용 Ag Paste의 물성 연구

Abstract

A Study on Properties of Ag Paste for NFC

Young-shin Kim

Dept. of Graphic Arts Engineering, Graduate School, Pukyong National University

Abstract A term, NFC(Near Field Communication) means 13.56MHz band contactless shrort-range wires telecommunication technology, it provides data communication between mobiles by going through a fusion of smart phone as well as mutual compatibility with existing contactless Smartcard technology and Radio Frequency Identification. The term, NFC has been used officially since ISO/IEC 18092 established in 2003 and NFC forum in 2004, but before that, 13.56MHz Wireless Communication Technology had been included into contactless smart card. Even up to recently, existing contactless smart card technology is utilizing generally for subway, bus fare card and credit card etc. and also using on a field of distribution and logistics with RFID tag. Although they kept on trying to put the contactless wireless communication technology on personal mobile phone to get out from fixed service of dedicated readers and IC card, it had limits to spread it on the market because a lack of service connection due to limited wireless internet connection environment, plus a limited application of general mobile phone and shortage of the phone quantity which has a NFC. However, nowadays the environment about service activation has been building due to a general use of smart phone, an appearance of mutual Electronic payment technology and global firm strategy about the payment market. Especially international companies such a Google, Apple, and Amazon etc. recognize about the mobile E-payment service which is based on the NFC(Near Field Communication) and they are driving to the business so that they can occupy the various related service market for advertising, personal certification, smart poster etc. Therefore, new smart phone model from Samsung, LG, Pantech as well as Nokia, number 1 of mobile phone manufacture load NFC antenna and the supply keep on increasing in NFC manufacture line. Previously NFC manufacture had used Etching, however the problem was that manufacture expense was very expensive due to the complex technic and high loss of material. Besides, since the expense occurred while handling after making the pattern is high and it impacts on the environment too much hence, they are developing the technology that is able to cover the problems and they have the aim for low expense, low risk, and simplification of process. Recently to cover the weakness of the etching, a printing method which use conductive paste is evaluated for the alternative and they are applying the screen print method instead. The strength of the screen printing method is low initial investment expense and simple printing stage so it has an advantage to make bulk production. On the research, we made an electrode which is using on NFC by applying screen printing method and reviewed the physical properties. In addition, we used the Ag powder of flake status and manufactured, reviewed the conductive paste according to the composition and content of Organic binder to get the substrate and the adhesion of the paste Rheology, Dispersibility, Conductivity, and Peel Strength.