PUKYONG

바인더에 따른 스크린 인쇄용 Ag Paste의 물성연구

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Abstract
A study on the characteristics of Ag pastes for screen printing by binder

Dong-jin Kim

Dept. of Graphic Arts Engineering, Graduate School,
Pukyong National University

Abstract

Domestic display the status of the industry is growing day by day. However, in large part due to lack of core technology and core materials are imported from abroad and Free continuing cost pressures in the display industry as a cost savings for the new method is required.
Today, large open world markets and the memory of electronic products in Korea, cpu and display markets such as semiconductor chip market is strong.
Semiconductor chips, circuit line widths of several tens nm is very high enough density, it was part of a family of very high performance can be seen.
Visible to the eye, while the display market to implement a display device, so if the pixel size of 70 microns or more are mostly very low density, so the relatively low performance belongs to the product family. These micro (μ) low-grade disposable electronic products / devices manufactured by the equipment, the printing process, a study using the technique began to receive the spotlight.
Electronic industry, printing technology, innovation and competitiveness through technology development efforts underway in the process was accepted as a suitable technique such printed electronics has been created, a new concept, the technology and electronic components and circuits efforts to apply to the creation is increasing.
Recently to cover the weakness of the etching, a printing method which use conductive paste is evaluated for the alternative and they are applying the screen print method instead.
The strength of the screen printing method is low initial investment expense and simple printing stage so it has an advantage to make bulk production.
In this study, flexible and strong adhesive on the ITO film has excellent electrical conductivity, were prepared by Ag Paste. Screen printing conductive patterns formed. Ag powders used flake-type. As a binder resin were manufactured using polyester resin and epoxy resin paste and dispersibility, Printability, electrically conductive adhesive film for evaluation.In this study, thermal curing after printing Screen printing manner (130℃ 10minute).
Author(s)
김동진
Issued Date
2013
Awarded Date
2013. 2
Type
Dissertation
Publisher
부경대학교
URI
https://repository.pknu.ac.kr:8443/handle/2021.oak/24826
http://pknu.dcollection.net/jsp/common/DcLoOrgPer.jsp?sItemId=000001966205
Affiliation
부경대학교 대학원
Department
대학원 인쇄공학과
Advisor
남수용
Table Of Contents
Ⅰ. 서 론 1

Ⅱ. 이 론 5
1. TSP(Touch Screen Panel) 5
가. TSP의 기본구조 5
나. TST의 동작원리 6
2. 스크린 인쇄 기술 8
3. 전도성 페이스트 11
가. 전도성 필러(Conductive Filler) 13
나. 바인더(binder) 14
다. Percolation point와 Percolation curve 15
라. 전도성 페이스트 분산 기술 16
4. 레올로지(Rheology) 17
가. 동적 점탄성(dynamic viscoelasticity) 20

Ⅲ. 실 험 23
1. 시료 23
가. Ag 분말 23
나. 바인더 24
다. 용제 26
2. 실험방법 27
가. Ag paste의 구성 27
나. 페이스트 제조방법 28
다. 스크린 인쇄 29
3. 측정 및 분석 30
가. Ag 페이스트의 분산 특성 측정 30
나. Ag 페이스트의 점도 측정 31
다. 전도성 패턴의 접착성 측정 31
라. 전도성 패턴의 전기전도성 측정 31
마. 전도성 패턴의 경도 측정 32

Ⅳ. 결과 및 고찰 33
1. 수지에 따른 Ag 페이스트의 레올로지 특성 33
2. 수지에 따른 Ag 페이스트의 분산 특성 36
3. 수지에 따른 전도성 패턴의 인쇄적성 37
가. Film에 따른 전도성 패턴의 접착성 37
나. 수지에 따른 전도성 패턴의 퍼짐성 39
다. 수지에 따른 전도성 패턴의 전기전도성 41
라. 수지에 따른 전도성 패턴의 경도 41

Ⅴ. 결 론 43

참고문헌 45
Degree
Master
Appears in Collections:
대학원 > 인쇄공학과
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