LED용 Heatsink의 방열성능 향상을 위한 전착도료 연구
- Abstract
- LED(Light Emitting Diode) lighting is now drawing attention as next generation lighting. The primary factor of the disadvantage for using is the heat radiated from LED lights. So the lifetime of LED lights is considerably reduced due to thermal degradation. The aim of this work is increased the service life to improve the user experience and the performance of LED lighting. Al, Al-Zn alloy, Mg alloy, etc. are used as the materials for heatsink due to the thermal conductivity and the light weight. The higher the output power and the more the number of the used lights are, the larger the size of heatsink is increased. To solve these problems for reducing the size of heatsink, the heatsinks with various cooling methods have been developed like the water-cooled heatsink, air-cooled heatsink, and heat pipe.
In this work, the coatings for electrodepositing(ED) were developed to improve the thermal conductivity of the coating film on heatsink. For the uniformity of the coating film, ED coating method was used instead of the spray coating method. To compare sphere pigments and acicular pigments adding for the thermal conductivity, the change of temperature on heatsink was investigated. The surface of the coating film was observed by SEM.
Adding pigment made the complex structure in coating film. it was thought that the complex structure provided the path for the thermal conductivity. It was found that the heatsink average temperature and the electrical resistance by networking between the pigments within the coating.
- Author(s)
- 김재춘
- Issued Date
- 2012
- Awarded Date
- 2012. 8
- Type
- Dissertation
- Publisher
- 부경대학교
- URI
- https://repository.pknu.ac.kr:8443/handle/2021.oak/25084
http://pknu.dcollection.net/jsp/common/DcLoOrgPer.jsp?sItemId=000001964969
- Affiliation
- 부경대학교 대학원
- Department
- 대학원 공업화학과
- Advisor
- 문명준
- Table Of Contents
- 목 차
제 1장. 서론
1-1. 현재 LED 산업에서의 방열도료
1-2. LED 조명의 사용으로 인한 경제적 효과
1-3. LED 조명에서 열과 전류의 크기로 인한 수명감소
1-4. LED 조명의 방열 기술
1-5. LED 조명의 Heatsink의 도장현황
제 2장. 이론적 배경
2-1. 전착코팅
2-2. 방열 메커니즘
2-3. Four point probe를 사용한 면 저항의 측정
제 3장. 실험방법
3-1. 사용원료
3-2. 실험방법
3-3. 분석방법
3-3-1. 도막두께 측정기를 사용한 도막두께 측정
3-3-2. 온도측정기를 사용한 MR16 Heatsink의 온도 측정
3-3-3. 전자현미경(SEM)을 사용한 도막 표면 관찰
3-3-4. Source Meter를 이용한 도막 저항 측정
제 4장. 결과 및 고찰
4-1. 도막두께에 따른 도막 표면 균일성 분석
4-2. 전자현미경(SEM)을 사용한 도막 표면 분석
4-3. Source Meter를 이용한 안료 함량에 따른 도막 저항 결과
4-4. 온도측정기에 나타난 MR16 Heatsink의 온도 특성 비교제 5장. 결론
참고문헌
- Degree
- Master
-
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- 대학원 > 공업화학과
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