무용제 타입 UV경화형 실버 페이스트 개발

Abstract

In this study, a solvent-free type UV curing silver paste was developed. In the formulation of the paste, the oligomers, monomers and photoinitiators were all taken the same. Combining the contents of spherical and plate-shaped silver and nano-sized silver prepared a total of 6 types of pastes. It measured the viscosity and viscoelasticity of the prepared paste. Patterns were printed by screen printing, but all were printed under the same printing conditions. After printing, an electrode coating film was formed by UV curing. Six samples were prepared for each paste by varying the exposure dose. It evaluated the conductivity, hardness and adhesion of the prepared samples. It selected the pastes with good results. The curing characteristics of the samples of the selected paste were evaluated by TGA and FT-IR. It evaluated the conductivity improvement by sintering the selected paste with high-intensity pulsed light with a broad spectrum. Results, the paste with the best conductivity, hardness, adhesion, and curing properties was a silver paste in which spherical silver powder and 10 nm silver powder were mixed in a ratio of 9:1. As a result of sintering, it seems that the dispersion of nano-sized silver is not good. It is judged that if the dispersion problem is improved, the conductivity will be better.