無電解 Ni-Cu-B 鍍金層의 電氣抵抗에 미치는 鍍金條件과 鍍金速度의 影響

Abstract

The effect of bath composition, plating condition and plating rate on the electric resistance behavior of electroless Ni-Cu-B deposits were investigated. With increasing nickel sulphate and copper sulphate concentrations in the bath, plating rate increased. While the resistivity of deposits increased as concentration of NiSO4 increased sharply in the bath. Plating reaction had been ceased when pH of the bath was below 5 or above 8, and temperature of the bath was below 40℃ or above 90℃. The resistivity of deposit was almost constant regardless of concentration change of complexing agent(malic acid) and pH variation in the bath. It was found that resistivity of deposit increased when reaction of spontaneous decomposition of the bath. The resistivity of deposits was invariable within 120min of plating time and below 300℃ of heating temperature.