첨단 SiCf/SiC 복합재료의 균열 치유와 초음파탐상 기술의 응용
- Alternative Title
- Crack healing and application of ultrasonic inspection of advanced SiCf/SiC composite
- Abstract
- After sintering the SiCf/SiC composite ceramics as material applied to blanket structure of fusion reactor, micro-crack was created by conducting Vickers test. The refraction of the crack was observed by using the SEM and the relation between the bending strength and the orientation of reinforced fiber was analyzed. There is no relation between the bending strength of SiCf/SiC composite ceramics and the size of a pre-crack until the limited crack size. Crack healing behavior was investigated on SiCf/SiC composite ceramics with a coating of SiO2 nano colloid on the surface using various methods, such as dipping and hydrostatic pressure. Although the coating treatment with SiO2 nano colloid is conducted according to the hydrostatic pressure method, SiO2 oxide is not created to the base of a crack. As a result, the recovery of bending strength cannot be anticipated.
Nondestructive evaluation (NDE) of ceramic matrix composites is essential to develope reliable ceramics for industrial applications. In this work, C-scan image analysis has been used to characterize surface cracks in SiCf/SiC composite ceramics nondestructively. The possibility of detecting surface cracks was evaluated experimentally using ultrasonic equipment of μ-SDS with a probe of 170 MHz. The defocus method could detect the shape of surface cracks. As a whole, when the defocus method for the probe was used, we conclude that there is a good possibility of detecting surface cracks.
It was studied on the nondestructive evaluation of the elastic wave signal of SiC ceramics and SiCf/SiC composite ceramics under monotonic tensile loading. The elastic wave signals of cross and unidirectional SiCf/SiC composite ceramics were obtained by pencil lead method and bending test. The time-frequency method which used by the discrete wavelet analysis algorithm was applied. The time-frequency analysis provides time variation of each frequency component involved in a waveform, which makes it possible to evaluate the contribution of SiC fiber frequency. The results were compared with the characteristic of frequency group from SiC slurry and fiber. Based on the results, if it is possible to shift up and design as a higher frequency group, we will can make the superior material better than those of existing SiCf/SiC composites.
- Author(s)
- 이희방
- Issued Date
- 2011
- Awarded Date
- 2011. 2
- Type
- Dissertation
- Publisher
- 부경대학교
- URI
- https://repository.pknu.ac.kr:8443/handle/2021.oak/9842
http://pknu.dcollection.net/jsp/common/DcLoOrgPer.jsp?sItemId=000001964102
- Alternative Author(s)
- Lee, Hee Bang
- Affiliation
- 부경대학교 대학원
- Department
- 대학원 기계공학학ㆍ연협동과정
- Advisor
- 남기우
- Table Of Contents
- 목 차
Abstract
제 1 장 서 론
1.1 연구의 배경 2
1.2 연구 목적 3
참고문헌 5
제 2 장 SiCf/SiC 복합재료의 굽힘 강도 특성 및 균열 치유 효과
2.1 서언 8
2.2 재료 및 실험방법 9
2.2.1 분말의 혼합 및 함침 9
2.2.2 소결과 가공 11
2.2.3 예균열의 도입 13
2.2.4 SiO2 나노 콜로이드 코팅 처리 15
2.2.5 열처리 조건 16
2.2.6 상온 굽힘 시험 16
2.2.7 파단면 관찰 16
2.3 실험결과 및 고찰 19
2.3.1 SiCf/SiC의 균열 크기에 따른 상온 굽힘 강도 19
2.3.2 SiCf/SiC의 SiO2 코팅법에 따른 균열 치유 특성 26
2.3.3 SiCf/SiC의 열처리 조건에 따른 균열 치유 특성 30
2.4 결언 32
참고문헌 33
제 3 장 Tyranno-SA SiC 섬유의 열처리 영향
3.1 서언 36
3.2 재료 및 실험방법 37
3.2.1 Tyranno-SA 섬유의 형상 37
3.2.2 열처리 조건 38
3.2.3 섬유 표면 관찰 38
3.3 실험결과 및 고찰 40
3.3.1 Tyranno-SA 섬유의 열처리 조건에 따른 표면 변화 관찰 40
3.3.2 Tyranno-SA 섬유의 열처리 조건에 따른 표면 성분 분석 42
3.4 결언 44
참고문헌 45
제 4 장 기지재 SiC 세라믹스의 코팅/열처리 효과
4.1 서언 47
4.2 재료 및 실험방법 49
4.2.1 분말의 혼합 및 함침 49
4.2.2 소결과 가공 49
4.2.3 SiO2 나노 콜로이드 코팅처리 51
4.2.4 열처리 조건 51
4.2.5 균열부 표면 관찰 52
4.3 실험결과 및 고찰 53
4.3.1 SiC의 정수압 단일 코팅법에 따른 균열 치유 특성 53
4.3.2 SiC의 정수압/롤 복합 코팅법에 따른 균열 치유 특성 55
4.4 결언 64
참고문헌 65
제 5 장 비파괴 검사에 의한 특성 평가
5.1 서언 69
5.2 실험방법 71
5.2.1 시험편 제작 71
5.2.2 C-scan 탐상을 위한 예균열의 도입 71
5.2.3 AE 탄성파 분석 73
5.2.3.1 펜슬리드 시험(Pencil lead method) 73
5.2.3.2 섬유 인장 시험 74
5.2.3.3 상온 3점 굽힘 시험 75
5.2.4 C-scan에 의한 표면 결함 검출 75
5.2.4.1 무라이 처리 75
5.2.4.2 C-scan 균열 탐상 77
5.3 실험결과 및 고찰 79
5.3.1 SiCf/SiC 복합재료의 AE 탄성파 분석 79
5.3.2 SiCf/SiC 복합재료의 C-scan 분석 88
5.3.2.1 SDS-win(25, 50 MHz)의 탐상 88
5.3.2.2 μ-SDS(125 MHz)의 탐상 90
5.3.2.3 μ-SDS(170 MHz)의 탐상 92
5.4 결언 96
참고문헌 98
제 6 장 결 론 100
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